Daniel Schmidt
Daniel Schmidt brings over 20 years of semiconductor metrology experience to Laser Thermal, with a career built at the intersection of advanced materials characterization and manufacturing-ready measurement solutions.
He earned his undergraduate degree in Microsystems Technology in Germany and his Ph.D. in Electrical Engineering from the University of Nebraska-Lincoln. He went on to hold a Senior Research Fellow position at the National University of Singapore, followed by senior roles at GlobalFoundries focused on metrology development for EUV lithography and process characterization. At IBM Research in Albany, he led a team developing metrology solutions for next-generation semiconductor manufacturing, working across optical and X-ray characterization techniques with a consistent focus on translating complex measurement capabilities into practical process control.
At Laser Thermal, Daniel leads technology strategy and the development of next-generation thermal metrology solutions. His work connects thermal property measurements to the materials selection, device performance, and reliability challenges that the semiconductor industry faces at every node. He brings particular depth in lab-to-fab transitions, ensuring that measurement capabilities developed in research environments become viable tools in manufacturing contexts.
He has authored or co-authored more than 80 journal articles and 125 conference contributions, and 3 book chapters, holds over 20 U.S. patents and applications, and is a Senior Member of SPIE, IBM Top Performer 2020, and Editorial Board Member of the Journal of Micro/Nanopatterning, Materials, and Metrology.